GDM300晶圆研磨WAFER GRINDING衡鹏

上海衡鹏实业有限公司为您提供gdm300晶圆研磨wafer grinding衡鹏。gdm300晶圆研磨wafer grinding衡鹏
—采用全自动系统，从后磨到贴装的连续过程
gdm300晶圆研磨wafer grinding特长：
·the process from back grinding to wafer mounting continuously by fully automatic system, which enable to grind till 25um thickness.
采用全自动系统，从后磨到贴装的连续过程，可研磨至25um厚度。
·with 2 head polishing stage, throughput is almost double compared with 1 polish head system.
2个磨头阶段，产量几乎是1个磨头系统的两倍。
·built in edge trimming system is available as an option for thin wafer process.
内置修边系统可作为薄型晶圆加工的选择。
·dual index system, which polishing stage&grinding stage is completely separated, satisfy the cleanness required for tsv&mems process.
双指标体系，抛光阶段和研磨阶段完全分离，满足tsv和mems工艺所需的清洁。
·less than ra1a ultra luminance, ultra mirror surface is possible.
超亮度小于ra1a，可超镜面。
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gdm300晶圆研磨wafer grinding相关产品：
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gnx200bp晶圆研磨/晶圆减薄/晶圆抛光/晶圆背抛/wafer grinding

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